发明名称 COIL SUBSTRATE
摘要 The present invention relates to a coil substrate. The coil substrate comprises: a substrate; a first spiral pattern which is disposed on a first surface of the substrate, and has a partially cut spiral shape; a second spiral pattern which is disposed on a second surface of the substrate, and has both ends electrically connected to the first spiral pattern; and a leading pattern which has one end connected to the first spiral pattern, and is disposed to cross a cut portion of the first spiral pattern from inside to outside of the first spiral pattern, wherein the cut portion of the first spiral pattern is electrically connected by multiple first via portions and the second spiral pattern.
申请公布号 KR20150122114(A) 申请公布日期 2015.10.30
申请号 KR20150146151 申请日期 2015.10.20
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHANG, KI WON;LIM, DAE KI;HAN, CHANG MOK;NAM, HYEON GIL;LEE, HYUN SEOK;CHO, SUNG EUN;SUNG, JAE SUK;KIM, TAE SUNG;AN, CHAN GWANG;BAE, SANG WOO
分类号 H01F5/00;H01F38/14 主分类号 H01F5/00
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