| 发明名称 |
VACUUM ADSORPTION APPARATUS AND A VACUUM ADSORPTION METHOD OF SEMICONDUCTOR PACKAGE |
| 摘要 |
Provided is a vacuum adsorption apparatus and a method of adsorbing a semiconductor package in a vacuum state. The vacuum adsorption apparatus includes a housing having an opening formed on its top surface, a vacuum adsorption unit disposed in the housing, and a stage formed on the opening formed in the housing and including a plurality of holes. A pressure generated from the vacuum adsorption unit is applied to the top surface of the stage through the opening and the plurality of holes. |
| 申请公布号 |
US2015311059(A1) |
申请公布日期 |
2015.10.29 |
| 申请号 |
US201514656645 |
申请日期 |
2015.03.12 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
KIM Yong-Ki;CHOI Joo-Hoon |
| 分类号 |
H01L21/02;B01D53/26 |
主分类号 |
H01L21/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A vacuum adsorption apparatus of a semiconductor package, the vacuum adsorption apparatus comprising:
a housing having an opening formed on a top surface of the housing; a vacuum adsorption unit disposed in the housing; and a stage formed on the opening formed in the housing and including a plurality of holes, wherein a pressure generated from the vacuum adsorption unit is applied to a top surface of the stage through the opening and the plurality of holes. |
| 地址 |
Suwon-si KR |
