MEMS Devices and Methods for Forming Same

摘要

Embodiments of the present disclosure include MEMS devices and methods for forming MEMS devices. An embodiment is a method for forming a microelectromechanical system (MEMS) device, the method including forming a MEMS wafer having a first cavity, the first cavity having a first pressure, and bonding a carrier wafer to a first side of the MEMS wafer, the bonding forming a second cavity, the second cavity having a second pressure, the second pressure being greater than the first pressure. The method further includes bonding a cap wafer to a second side of the MEMS wafer, the second side being opposite the first side, the bonding forming a third cavity, the third cavity having a third pressure, the third pressure being greater than the first pressure and less than the second pressure.

主权项

1. A microelectromechanical systems (MEMS) device comprising:
a MEMS wafer comprising at least one MEMS structure; a first sealed cavity in the MEMS wafer, the first sealed cavity having a first pressure; a cap wafer bonded to a first side of the MEMS wafer; a second cavity between the MEMS wafer and the cap wafer, the second cavity having a second pressure, the second pressure being greater than the first pressure; a carrier wafer bonded to a second side of the MEMS wafer, the second side being opposite the first side; and a third cavity between the carrier wafer and the MEMS wafer, the third cavity having a third pressure, the third pressure being greater than the second pressure.