发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a technology for efficiently attaching/removing a wire to/from a stage on which a substrate is thermally processed.SOLUTION: A wire 3 is disposed on a surface of a stage 2 on which heating treatment is performed to a substrate 90. The wire 3 is folded at the lateral side of the stage 2 to continuously traverse the surface of the stage 2 several times. Multiple hooks 41, on which the wire 3 hooks, are provided at a long member 40 disposed at a side part of the stage 2. The long member 40 is connected with a fixed part 23 fixed to the stage 2 through multiple elastic members 54. The long member 40 is biased to the lower side by the multiple elastic members 54 thereby causing the wire 3 hooking on the hooks 41 to be pulled.</p>
申请公布号 JP2015188036(A) 申请公布日期 2015.10.29
申请号 JP20140065286 申请日期 2014.03.27
申请人 SCREEN HOLDINGS CO LTD 发明人 KAMIBAYASHI MAKOTO
分类号 H01L21/027;G02F1/13;H01L21/683 主分类号 H01L21/027
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