BESSEL BEAM LASER MACHINING APPARATUS FOR HIGH ASPECT RATE HOLE
摘要
The present invention aims to provide a Bessel beam laser machining apparatus for a high aspect ratio hole, which allows a micro-shape having a high aspect ratio to be processed with high degree of accuracy by performing laser machining using a Bessel beam. The other aim of the present invention is to provide the Bessel beam laser machining apparatus for processing a high aspect ratio hole, which is economical and excellently compatible with an existing apparatus by allowing only a simple optical system to be the necessary composition to perform high aspect ratio machining.
申请公布号
KR20150121330(A)
申请公布日期
2015.10.29
申请号
KR20140046530
申请日期
2014.04.18
申请人
KOREA INSTITUTE OF MACHINERY & MATERIALS
发明人
CHO, SUNG HAK;CHOI, WON SUK;YOON, JI WOOK;KIM, HUN YOUNG;CHOI, JI YEON;KIM, JAE GU;WHANG, KYUNG HYUN