发明名称 CHIP WITH ENHANCED LIGHT EXTRACTION
摘要 Described herein are devices and methods incorporating light extraction features for improving light extraction in light emitting diode (LED) chips, for example, thin-film semiconductor LED chips such as thin film GaN chips. These features can be located in the semiconductor diode region of an LED chip and are configured to improve device light extraction by redirecting light emitted by the chip's active region. In some embodiments, the light extraction features can comprise a material with a refractive index lower than the surrounding semiconductor material. In some embodiments, the light extraction features are shaped to improve light extraction and can be formed as protrusions, indentations and can comprise various features such as sloped sidewalls. Also disclosed herein are contact configurations for improving electrical conductivity in the disclosed devices.
申请公布号 US2015311387(A1) 申请公布日期 2015.10.29
申请号 US201514697282 申请日期 2015.04.27
申请人 CREE, INC. 发明人 Heikman Sten;DiMaria Jeffrey Vincent
分类号 H01L33/10;H01L33/22;H01L33/32;H01L27/15;H01L33/58;H01L33/24;H01L33/08;H01L33/00;H01L33/60 主分类号 H01L33/10
代理机构 代理人
主权项 1. A light emitting diode (LED) chip, comprising: a semiconductor material based diode region comprising an active region; and one or more light extraction features within said diode region, said one or more light extraction features dissecting 40% or greater of the thickness of said diode region and configured to redirect light emitted from said active region to improve light extraction from an emission surface of said LED chip.
地址 Durham NC US