| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a lamination device manufacturing method with which an alignment mark used when plural wafers are laminated can be easily formed in a short time.SOLUTION: An alignment mark (17, 27) is formed after a metal layer (15, 25) is formed on the surface (11a, 21a) of a wafer (10, 20) so as to have a thickness which allows light transmission through the metal layer. In the formation of the alignment mark (17, 27), after a resist film (16, 26) is formed on the surface of the metal layer, the surface of the wafer is imaged through the resist layer and the metal layer by imaging means (C), and a mask (M) is positioned in conformity with the position of a semiconductor device formed on the surface. Thereafter, exposure, development and etching are performed to form the alignment mark comprising the metal layer. Plural wafers are positioned by using the alignment mark, and then attached to one another, thereby forming sticking wafers. The sticking wafers are parted into individual lamination devices.</p> |
