| 摘要 |
Provided is a wiring substrate having reduced variation of electrical resistance caused by sublimation of platinum at high temperatures, in temperature-sensing wire-shaped conductors that include platinum. This wiring substrate (3) is provided with: an insulated substrate (1) comprising a plurality of laminated insulating layers (1a), and having an upper surface, a lower surface, and side surfaces; and a plurality of wire-shaped conductors (2) comprising platinum or containing platinum as the predominant component, having a first end portion (A) and a second end portion (B) on the opposite side from the first end portion (A), and being arranged between a plurality of layers among the plurality of insulating layers (1a). Of the wire-shaped conductors (2), the wire width of those positioned between layers closest to the upper surface or lower surface of the insulated substrate (1) is greater than the wire width of those positioned between the other layers. Due to the relatively greater absolute quantity of metal material in wire-shaped conductors (2) that are positioned between layers closest to the upper surface or lower surface of the insulated substrate (1), the relative decrease in volume (sectional area) of the wire-shaped conductors (2) due to sublimation of platinum is reduced, and accuracy of temperature measurement remains high over an extended period. |
