| 发明名称 |
RESIN COMPOSITION FOR SEALING ORGANIC ELECTRONICS DEVICES AND ORGANIC ELECTRONICS DEVICE |
| 摘要 |
An organic electronic device sealing resin composition including a block copolymer hydride obtained by hydrogenating 90% or more of all unsaturated bonds of a block copolymer, wherein the block copolymer includes: two or more polymer blocks [A] per one molecule of the copolymer, the block having an aromatic vinyl compound unit as a main component; and one or more polymer blocks [B] per one molecule of the copolymer, the block having a linear conjugated diene compound unit as a main component, and a ratio between a weight fraction wA of all the polymer blocks [A] in the entire block copolymer and a weight fraction wB of all the polymer blocks [B] in the entire block copolymer (wA:wB) is 20:80 to 60:40. |
| 申请公布号 |
US2015307758(A1) |
申请公布日期 |
2015.10.29 |
| 申请号 |
US201314650470 |
申请日期 |
2013.11.28 |
| 申请人 |
ZEON CORPORATION |
发明人 |
TAZAKI Satoshi;KASHIWAGI Motofumi;ISHIGURO Atsushi;KOIDE Yohei |
| 分类号 |
C09K3/10;H01L51/52;H01L51/00 |
主分类号 |
C09K3/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An organic electronic device sealing resin composition comprising a block copolymer hydride obtained by hydrogenating 90% or more of all unsaturated bonds of a block copolymer,
wherein the block copolymer includes: two or more polymer blocks [A] per one molecule of the copolymer, the block having an aromatic vinyl compound unit as a main component; and one or more polymer blocks [B] per one molecule of the copolymer, the block having a linear conjugated diene compound unit as a main component, and a ratio between a weight fraction wA of all the polymer blocks [A] in the entire block copolymer and a weight fraction wB of all the polymer blocks [B] in the entire block copolymer (wA:wB) is 20:80 to 60:40. |
| 地址 |
Tokyo JP |
