| 摘要 |
Provided is an electronic element mounting substrate, which is capable of suppressing generation of cracks or breakage in a first wiring board overlapping a peripheral end section of a metal plate, and which can have a reduced thickness as a whole even if a second wiring board is connected thereto. An electronic element mounting substrate (1) has: a frame-like first wiring board (2), which has an inner portion thereof as a first through hole (2a), and which has an external circuit connecting electrode (9) on the lower surface; a metal plate (4), which is provided on the lower surface of the first wiring board (2) such that an opening of the first through hole (2a) is covered with the metal plate, and which has an outer end positioned between an outer end of the first wiring board (2) and an inner end of the first wiring board (2), said metal plate having an electronic element mounting section (11) in an upper surface region surrounded by means of the first wiring board (2); and a second wiring board (6), which is provided in a surrounding region (5) of the metal plate (4), said surrounding region being a part of the lower surface of the first wiring board (2), and which is electrically connected to the external circuit connecting electrode (9). |
