发明名称 PACKAGE, ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOBILE BODY
摘要 A package includes an accommodation space portion, and a first base body that forms at least a part of the accommodation space portion. A first through-hole, which extends toward a second surface on an accommodation space portion side from a first main surface opposite to the accommodation space portion, is provided in the first base body, in a cross-sectional view of the first through-hole, the first through-hole includes a first inclined portion that is inclined from the second surface toward the first main surface, and a second inclined portion that is inclined from one end on a first main surface side of the first inclined portion toward the first main surface, a second angle made by the second inclined portion and the second surface is larger than a first angle made by the first inclined portion and the second surface, and the first through-hole is sealed with a sealing member.
申请公布号 US2015313016(A1) 申请公布日期 2015.10.29
申请号 US201514693059 申请日期 2015.04.22
申请人 Seiko Epson Corporation 发明人 NARUSE Atsuki
分类号 H05K1/11;G01P1/02;H05K1/18;B81C1/00;H05K1/03 主分类号 H05K1/11
代理机构 代理人
主权项 1. A package, comprising: an accommodation space portion; and a first base body that forms at least a part of the accommodation space portion, wherein a first through-hole, which extends toward a second surface on an accommodation space portion side from a first main surface opposite to the accommodation space portion, is provided in the first base body, in a cross-section view of the first through-hole, the first through-hole includes a first inclined portion that is inclined from the second surface toward the first main surface, and a second inclined portion that is inclined from one end on a first main surface side of the first inclined portion toward the first main surface, a second angle made by the second inclined portion and the second surface is larger than a first angle made by the first inclined portion and the second surface, and the first through-hole is sealed with a sealing member.
地址 Tokyo JP