WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

摘要

PURPOSE: A wiring board and a manufacturing method thereof are provided to prevent the generation of a crack by forming an electrode pad at the boundary between an insulating layer and an electrode pad which is formed in a recess of the insulating layer. CONSTITUTION: An electrode pad(23) is exposed from an insulating layer(20). The electrode pad comprises a central part and a peripheral part which includes a flat plane. An adjusting layer is formed in an opening within resist and adjusts the shape of the electrode pad. The adjusting layer the flat plane which is parallel to a supporter and an inclined plane which is extended to the sidewall of the opening from the edge of the flat plane. The insulating layer which includes a pad main body of the electrode pad and a wiring is formed on the adjusting layer. A wiring layer(21) is electrically combined in the electrode pad. A wiring layer is arranged on the insulating layer.