发明名称 MULTI-LAYER INSULATING FILM, METHOD OF MANUFACTURING MULTI-LAYER INSULATING BOARD AND MULTI-LAYER BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a multi-layer insulator film that can enhance the flatness of the surface of an insulating layer and adhesion strength between the insulating layer and a metal layer.SOLUTION: A multi-layer insulating film has an insulating layer of two or more layers. One outermost layer contains a thermosetting component and contains either inorganic filler or no inorganic filler, and the layers excluding the one outermost layer contain a thermosetting component and an inorganic filler. The content of the inorganic filler of the one outermost layer is smaller than the content of the inorganic filler of the layers excluding the one outermost layer. When the elasticity modulus of the one outermost layer is represented by G'(A) and the elasticity modulus of the layers excluding the one outermost layer is represented by G'(B) under a dynamic viscoelasticity measurement at a frequency of 6.28 rad/sec, (Log10(G'(B)) at 100°C)-( Log10(G'(A))at 100°C) is 0 to 2.</p>
申请公布号 JP2015188073(A) 申请公布日期 2015.10.29
申请号 JP20150047155 申请日期 2015.03.10
申请人 SEKISUI CHEM CO LTD 发明人 HAYASHI TATSUJI;KUNIKAWA TOMOTERU;TANAKA TOSHIAKI;SHIRAHASE KAZUTAKA
分类号 H05K3/46;B32B27/00;B32B27/20;H05K1/03 主分类号 H05K3/46
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