发明名称 FILM THICKNESS MEASURING DEVICE AND POLISHING DEVICE
摘要 The present invention improves versatility of a film thickness measuring device. The trigger sensor 220 includes a proximity sensor 222 and a dog 224, and outputs a trigger signal indicating that a polishing table 110 makes one revolution. The eddy current sensor 210 measures a film thickness of a subject to be polished 102 at a timing based on the trigger signal output from the trigger sensor 220. The dog 224 is disposed in an opposite region 250 located at the opposite side of a rotation axis CW of the top ring 116 with respect to a rotation axis CT of the polishing table 110. Further, the eddy current sensor 210 and the proximity sensor 222 are disposed at the polishing table 110 so as to be located in the opposite region 250 when the trigger signal is output from the trigger sensor 220.
申请公布号 SG10201501848T(A) 申请公布日期 2015.10.29
申请号 SGT10201501848 申请日期 2015.03.11
申请人 EBARA CORPORATION 发明人 SHINOZAKI, HIROYUKI
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