| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a novel thermosetting resin composition using an epoxy compound, and further provide a resin composition that contributes to the provision of a cured product to get new functions by the provision of a novel thermosetting resin composition.SOLUTION: The thermosetting resin composition comprises a glycidyl ester type epoxy compound, a gallium compound, and a silanol source compound.</p> |
