PACKAGE-ON-PACKAGE BASED INTEGRATED CIRCUIT CHIP IMAGER

摘要

An apparatus for use in decoding a bar code symbol includes a first integrated circuit chip with a wafer level camera, at least one light source, and a plurality of contact pads on a surface of the chip and a second integrated circuit chip with a processor, memory, plurality of contact pads on a surface of the chip, and plurality of contact pads on another surface of the chip. The apparatus includes a PCB having a plurality of contact pads disposed on at least one surface of the PCB and wherein the first and second integrated circuit chips are vertically stacked on the PCB and the plurality of contact pads on the first and second integrated circuit chips interface with the contact pads of the second integrated circuit chip and PCB. The apparatus is operative for processing image signals generated by the WLC for attempting to decode the bar code symbol.

主权项

1. An apparatus for decoding a symbol, the apparatus comprising:
a first integrated circuit chip comprising:
a wafer level camera; anda plurality of contact pads disposed on a first surface of the first integrated circuit chip; a second integrated circuit chip comprising:
a plurality of contact pads disposed on a first surface of the second integrated circuit chip; anda plurality of contact pads disposed on a second surface of the second integrated circuit chip; a printed circuit board comprising a plurality of contact pads disposed on a surface of the printed circuit board; wherein the first integrated circuit chip and the second integrated circuit chip are stacked in an X-Y plane on the printed circuit board such that:
the plurality of contact pads on the first integrated circuit chip define an interface with the plurality of contact pads on the second integrated circuit chip to allow a communication of signals between the first integrated circuit chip and the second integrated circuit chip; andthe plurality of contact pads on the second integrated circuit chip define an interface with the plurality of contact pads on the printed circuit board to allow a communication of signals between the first integrated circuit chip, second integrated circuit chip, and printed circuit board; and wherein the apparatus is operative for processing of image signals generated by the wafer level camera for attempting to decode a symbol.