SUBSTRATE POLISHING APPARATUS

摘要

To provide a substrate polishing apparatus capable of effectively trapping a harmful substance suspended in a polishing chamber. The substrate polishing apparatus includes a polishing portion (303) that polishes a substrate in a polishing chamber (300), a gas supply port (301) that supplies gas into the polishing chamber (300), a gas discharge port (304) that discharges the gas from inside the polishing chamber (300), and a spray nozzle (302) that is provided on an inner wall surface of the polishing chamber (300) and sprays a cleaning liquid in a mist into the polishing chamber (300). The gas supply port (301) is arranged to generate a swirl flow.