| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To enable a suction nozzle of a component mounting machine to stably suck a wafer component without damage in the component mounting machine in which a wafer component supply device is set. <P>SOLUTION: A height position of an upper surface of a push-up pot 27 is measured by a height sensor using a reference height position of a component mounting machine 25 as a reference by raising the push-up pot 27 to a sheet sucking position in contact with a lower surface of a dicing sheet 36 in a state that a wafer palette 22 is not set at a wafer palette set position above the push-up pot 27 before starting production, and a descent position of a suction nozzle 30 at the time of wafer component sucking operation is corrected in accordance with the measured height position of the upper surface of the push-up pot 27. The height sensor is attached downward to a mounting head holding the suction nozzle 30 of the component mounting machine, and the position of the height sensor is moved to the position just above the push-up pot 27 by moving the mounting head in an XY direction before measuring the height position of the upper surface of the push-up pot 27. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
