Semiconductor device and method of manufactoring semiconductor device

摘要

According to one embodiment, a semiconductor device (16) includes a first conductor (34), a second conductor (36), and an envelope (71). The first conductor (34) includes a first radiation surface (34b). The second conductor (36) includes a second radiation surface (36b). The envelope (71) includes a first envelope portion (52) which is composed of a first insulative material and is formed such that the first envelope portion (52) seals a semiconductor (38), and a second envelope portion (62) which is composed of a second insulative material and is formed in contact with the first radiation surface (34b) and the second radiation surface (36b).