PHOTOSENSITIVE SILICONE RESIN COMPOSITION

摘要

Provided is a resin composition which gives a cured product of a photocurable resin having excellent crack resistance even when formed into a thick film, and capable of maintaining a low coefficient of linear thermal expansion, low thermal weight loss, and a low cure shrinkage. This photosensitive silicone resin composition comprises (A) a silica particle-containing condensation reaction product and (B) a photopolymerization initiator, and is characterized in that the silica particle- containing condensation reaction product (A) is a condensation reaction product of a polysiloxane compound (a) comprising a hydrolytic condensation product of one or more silane compounds represented by the following general formula (1): R 1 n1 SiX 1 4-n1 (wherein R 1 , n1 and X 1 are defined in the claims) and/or the silane compound, and silica particles (b), and has a terminal structure Si-O-Y (wherein Y is defined in the claims) which satisfies the following formula (2): 0 < [Si-O-SiR 3 3 ]/([Si-O-R 2 ] + [Si-O-SiR 3 3 ]) ‰¤ 1 (wherein, R 2 and R 3 are defined in the claims), and has a photopolymerizable functional group.