Wiring board having an engineered metallization layer

摘要

The present invention relates to a method of manufacturing a printed wiring board (PWB) of the type depicted in FIG. 1, and to the resulting PWB. Such a PWB comprises a first substrate and alternating layers of a second substrate and a metal layer. The layer 2 metallization of the PWB is a thick layer of a composite engineered metal material having a configurable coefficient of thermal expansion (CTE) to provide CTE matching with respect to radio frequency (RF) components mounted on the PWB, and having substantial heat dissipation properties to dissipate heat generated by the RF components. This composite metal layer also provides a ground plane for the RF components.

主权项

1. A printed wiring board (PWB), comprising:
a first substrate; at least two alternating layers of a second substrate and a metal layer; and a layer 2 metallization layer including a 10-50 mil thick layer of metal-graphite composite material having a configurable CTE that provides substantial CTE matching with respect to radio frequency (RF) components mounted on the layer 2 metallization layer, said layer of metal-graphite composite material having substantial heat dissipation properties to dissipate heat generated by said RF components, and serving as a ground plane for said RF components wherein said layer 2 metallization layer being below the first substrate and having an exposed surface to which the RF component is mounted.