发明名称 |
Patterned metal layer to control solder connection between laser and submount in a magnetic head |
摘要 |
A laser diode device is affixed to a mounting face of a slider, opposite the air bearing surface. The laser includes a submount having an electrically conductive surface layer that is normal to the mounting face. The electrically conductive surface layer is a patterned metal layer that includes a lateral probing region and a laser mounting region to which a laser is soldered. The laser mounting region is connected to the lateral probing region by a bridge portion of the patterned metal layer. The laser mounting region is otherwise separated from the lateral probing region by a solder blocking gap in which the submount lacks the patterned metal layer, and which is adjacent to the laser. The solder blocking gap defines a solder blocking gap height normal to the mounting face that is in the range of ⅔rds to ⅚ths of a total height of the laser mounting region. |
申请公布号 |
US9171562(B1) |
申请公布日期 |
2015.10.27 |
申请号 |
US201514663031 |
申请日期 |
2015.03.19 |
申请人 |
Western Digital (Fremont), LLC |
发明人 |
Puttichaem Wachira;Ouyang Bin |
分类号 |
G11B11/00;G11B13/08;G11B5/48;G11B5/60;G11B7/12;G11B5/00 |
主分类号 |
G11B11/00 |
代理机构 |
|
代理人 |
|
主权项 |
1. A head comprising:
a slider having an air bearing surface, a trailing face that is normal to the air bearing surface, and a mounting face that is opposite but substantially parallel to the air bearing surface; a magnetic transducer disposed on the trailing face of the slider; and a laser device affixed to the mounting face, the laser device including
a submount having an electrically conductive surface layer that is normal to the mounting face, the electrically conductive surface layer being a patterned metal layer that includes a laser diode mounting region and a lateral probing region; anda laser diode that is soldered to the laser diode mounting region;wherein the laser diode mounting region is connected to the lateral probing region by a bridge portion of the patterned metal layer, and the laser diode mounting region is otherwise separated from the lateral probing region by a solder blocking gap in which the submount lacks the patterned metal layer and that is adjacent to the laser diode; andwherein the laser diode mounting region defines a laser diode mounting region total height normal to the mounting face, and the solder blocking gap defines a solder blocking gap height normal to the mounting face that is in the range of ⅔rds to ⅚ths of the laser diode mounting region total height. |
地址 |
Fremont CA US |