发明名称 Laser material processing tool
摘要 An apparatus for laser drilling including a laser beam emitter disposed within a housing having at least one laser beam outlet and at least one purge fluid outlet. At least one actuated nozzle is disposed within the housing for providing a purge fluid through the purge fluid outlet and having functional control for synchronized programmable activation patterns. Laser beam control is provided for directing a laser beam over a target surface.
申请公布号 US9168612(B2) 申请公布日期 2015.10.27
申请号 US201113015632 申请日期 2011.01.28
申请人 Gas Technology Institute;Halliburton Energy Services, Inc. 发明人 Wilkiel Lloyd;Skinner Neal Gregory;Hunter Timothy Holiman
分类号 E21C37/16;B23K26/14;B23K26/06;B23K26/38;E21B7/14;B23K26/04 主分类号 E21C37/16
代理机构 Pauley Petersen & Erickson 代理人 Pauley Petersen & Erickson
主权项 1. A laser material processing tool for processing material within a wellbore, the laser material processing tool comprising: a laser head assembly comprising a housing having at least one laser energy outlet and a plurality of purge fluid outlets concentrically disposed around said at least one laser energy outlet; at least one optical emitter suitable for emitting laser energy disposed within said housing; laser energy control means for directing said laser energy over a target surface; at least one automated purge fluid emitter adapted to emit a purge fluid through at least one of said plurality of purge fluid outlets; and synchronization means for synchronizing cyclic sequential emissions of said laser energy and said purge fluid directed at said target surface, said synchronization means comprises activation program for activating purge fluid flow through said purge fluid outlets in a user-defined programmable sequence, wherein said sequential emission of laser energy from said at least one optical emitter and emission of purge fluid from said plurality of purge fluid outlets comprises a laser beam is followed by a purge fluid jet which removes material weakened by the laser beam from the target surface to form a hole at the target surface.
地址 Des Plaines IL US