发明名称 |
APPARATUS AND METHOD FOR STRIPPING SOLDER METALS DURING THE RECYCLING OF WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT |
摘要 |
Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module. |
申请公布号 |
IN1462KON2014(A) |
申请公布日期 |
2015.10.23 |
申请号 |
IN2014KOLNP1462 |
申请日期 |
2014.07.11 |
申请人 |
ADVANCED TECHNOLOGY MATERIALS,INC. |
发明人 |
CHEN, TIANNIU;KORZENSKI, MICHAEL B.;JIANG, PING |
分类号 |
B09B3/00;B09B5/00 |
主分类号 |
B09B3/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|