NONPLANAR ANTENNA EMBEDDED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

摘要

A nonplanar antenna embedded package structure and a method of manufacturing the same are introduced. The structure includes a nonplanar antenna component. The nonplanar antenna component comprises an antenna substrate, metal wiring, through-hole, and metal bump. The substrate surface covers the metal wiring. The through-hole penetrates the substrate from the antenna substrate bottom side but does not penetrate the metal wiring, and does not affect its appearance. The metal bump is implanted in the through-hole from the antenna substrate bottom side to join the metal wiring. An electronic component having a copper cable is provided. An end of the copper cable protrudes from the electronic component and is inserted into the through-hole of the antenna component to join the metal bump, thereby forming the nonplanar antenna embedded package structure characterized by: preventing the antenna metal wiring from exposing, and reducing interference otherwise arising from antenna resonance frequency and noise.

主权项

1. A method of manufacturing a nonplanar embedded package, the method comprising the steps of:
(1) providing a nonplanar antenna component comprising an antenna substrate and a metal wiring covering on a surface of the antenna substrate; (2) drilling a bottom side of the nonplanar antenna component to form a through-hole, wherein the through-hole penetrates the antenna substrate from a bottom side of the antenna substrate but does not penetrate the metal wiring; (3) implanting a metal bump into the through-hole to form a join end; (4) providing an electronic component having a copper cable, wherein an end of the copper cable protrudes from the electronic component, and another end of the copper cable is received in the electronic component; and (5) inserting an end of the copper cable of the electronic component into the through-hole to connect with the join end, followed by performing alignment and reflow such that the copper cable and the metal bump are joined and fixed to each other, thereby forming a nonplanar antenna embedded package component.