| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a circuit member connection adhesive that enables adhesion at low temperature and that possesses both adhesion strength of high stability and a circuit connecting property.SOLUTION: Provided are: a circuit member connection adhesive in which the fluorine atom content at the surface of the circuit member connection adhesive is in a range of 0.1 to 3.0 atom%; the circuit member connection adhesive in which the fluorine atom content at the surface of the circuit member connection adhesive is one measured by energy dispersive X-ray analysis (EDX); and the circuit member connection adhesive whose shape is like a film.</p> |
