发明名称 |
ION BEAM PROCESSING METHOD AND ION BEAM PROCESSING APPARATUS |
摘要 |
An ion beam etching method includes applying a positive voltage for extracting ions into a vacuum container to a first electrode, under a first condition where irradiation of a substrate with an ion beam is blocked off by a shutter, generating plasma in an internal space under the first condition, forming the ion beam by forming, under the first condition, a second condition where a positive voltage is applied to the first electrode and a negative voltage is applied to a second electrode, and moving the shutter and processing the substrate by irradiating the substrate with the ion beam. |
申请公布号 |
US2015303028(A1) |
申请公布日期 |
2015.10.22 |
申请号 |
US201514751903 |
申请日期 |
2015.06.26 |
申请人 |
CANON ANELVA CORPORATION |
发明人 |
Kamiya Yasushi;Akasaka Hiroshi;Konno Yuta |
分类号 |
H01J37/24;H01J37/20;H01J37/305;H01J37/04;H01J37/32 |
主分类号 |
H01J37/24 |
代理机构 |
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代理人 |
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主权项 |
1. An ion beam processing method for processing a substrate placed in a processing chamber linked to a plasma generation chamber by irradiating the substrate with an ion beam extracted and formed from plasma generated in the plasma generation chamber having an internal space, comprising:
applying a positive voltage for extracting ions into the processing chamber to a first electrode disposed facing the internal space, in a portion of linkage between the plasma generation chamber and the processing chamber, under a first condition where irradiation of the substrate with the ion beam is blocked off by a shutter; generating the plasma in the internal space under the first condition; forming the ion beam by forming, under the first condition, a second condition where a positive voltage is applied to the first electrode and a negative voltage is applied to a second electrode disposed closer to the processing chamber than the first electrode, in the portion of linkage; and moving the shutter and processing the substrate by irradiating the substrate with the ion beam. |
地址 |
Kawasaki-shi JP |