发明名称 ION BEAM PROCESSING METHOD AND ION BEAM PROCESSING APPARATUS
摘要 An ion beam etching method includes applying a positive voltage for extracting ions into a vacuum container to a first electrode, under a first condition where irradiation of a substrate with an ion beam is blocked off by a shutter, generating plasma in an internal space under the first condition, forming the ion beam by forming, under the first condition, a second condition where a positive voltage is applied to the first electrode and a negative voltage is applied to a second electrode, and moving the shutter and processing the substrate by irradiating the substrate with the ion beam.
申请公布号 US2015303028(A1) 申请公布日期 2015.10.22
申请号 US201514751903 申请日期 2015.06.26
申请人 CANON ANELVA CORPORATION 发明人 Kamiya Yasushi;Akasaka Hiroshi;Konno Yuta
分类号 H01J37/24;H01J37/20;H01J37/305;H01J37/04;H01J37/32 主分类号 H01J37/24
代理机构 代理人
主权项 1. An ion beam processing method for processing a substrate placed in a processing chamber linked to a plasma generation chamber by irradiating the substrate with an ion beam extracted and formed from plasma generated in the plasma generation chamber having an internal space, comprising: applying a positive voltage for extracting ions into the processing chamber to a first electrode disposed facing the internal space, in a portion of linkage between the plasma generation chamber and the processing chamber, under a first condition where irradiation of the substrate with the ion beam is blocked off by a shutter; generating the plasma in the internal space under the first condition; forming the ion beam by forming, under the first condition, a second condition where a positive voltage is applied to the first electrode and a negative voltage is applied to a second electrode disposed closer to the processing chamber than the first electrode, in the portion of linkage; and moving the shutter and processing the substrate by irradiating the substrate with the ion beam.
地址 Kawasaki-shi JP