Provided is a highly reliable semiconductor device in which peeling is prevented from progressing and an unfilled resin is prevented from occurring while maintaining the production efficiency and the cost. The semiconductor device comprises: a die pad; a lead; a down-bond tab formed in the periphery of the die pad; a semiconductor element mounted on the die pad through a die bond portion; a first wire for connecting a lead and a first electrode formed on the upper surface of the semiconductor element; and a sealing resin formed so as to expose the bottom surface of the die pad and cover the lead, the die pad, and the semiconductor element including the first wire. In the semiconductor device, a part of the down-bond tab and a central portion of the die pad are connected by a die pad-tab connection portion provided so as to have a step with respect to the upper surface of the down-bond tab and the upper surface of the die pad.
