发明名称 |
COOLING DEVICE FOR ELECTRONIC APPARATUS AND ELECTRONIC APPARATUS MOUNTED WITH COOLING DEVICE FOR ELECTRONIC APPARATUS |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a small size cooling device for electronic apparatus and an electronic apparatus mounted with the cooling device for electronic apparatus.SOLUTION: A CPU and memory 6 are cooled with a circulation path using no pump. A heat receiving part for cooling the memory 6 has a memory cover 6a covering the memory 6 at the lower plane side (an example of one plane). The heat receiving part includes: a plate-like heat receiving part 18 which has plural concavities 17 covering the front end part of the memory cover 6a; and a refrigerant conduit 19 which is disposed so as to heat-conduit on the one plane side of the heat receiving part 18.</p> |
申请公布号 |
JP2015185709(A) |
申请公布日期 |
2015.10.22 |
申请号 |
JP20140061343 |
申请日期 |
2014.03.25 |
申请人 |
PANASONIC IP MANAGEMENT CORP |
发明人 |
SUZUKI AYAKA;SATO IKU |
分类号 |
H05K7/20;G06F1/20;H01L23/427 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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