发明名称 COOLING DEVICE FOR ELECTRONIC APPARATUS AND ELECTRONIC APPARATUS MOUNTED WITH COOLING DEVICE FOR ELECTRONIC APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a small size cooling device for electronic apparatus and an electronic apparatus mounted with the cooling device for electronic apparatus.SOLUTION: A CPU and memory 6 are cooled with a circulation path using no pump. A heat receiving part for cooling the memory 6 has a memory cover 6a covering the memory 6 at the lower plane side (an example of one plane). The heat receiving part includes: a plate-like heat receiving part 18 which has plural concavities 17 covering the front end part of the memory cover 6a; and a refrigerant conduit 19 which is disposed so as to heat-conduit on the one plane side of the heat receiving part 18.</p>
申请公布号 JP2015185709(A) 申请公布日期 2015.10.22
申请号 JP20140061343 申请日期 2014.03.25
申请人 PANASONIC IP MANAGEMENT CORP 发明人 SUZUKI AYAKA;SATO IKU
分类号 H05K7/20;G06F1/20;H01L23/427 主分类号 H05K7/20
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