| 发明名称 |
SUSPENSION BOARD WITH CIRCUIT |
| 摘要 |
A suspension board with circuit includes a pad portion configured to be bonded to an electronic element. The pad portion includes a conductive layer; in the pad portion, a through hole passing through the pad portion with its periphery closed by the pad portion is formed; and at least a part of an inner peripheral surface facing the through hole in the pad portion is divided only by the conductive layer. |
| 申请公布号 |
US2015305156(A1) |
申请公布日期 |
2015.10.22 |
| 申请号 |
US201514690827 |
申请日期 |
2015.04.20 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
FUJIMURA Yoshito;TERADA Naohiro |
| 分类号 |
H05K1/11;H05K1/18 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A suspension board with circuit comprising:
a pad portion configured to be bonded to an electronic element, wherein the pad portion includes a conductive layer; in the pad portion, a through hole passing through the pad portion with its periphery closed by the pad portion is formed; and at least a part of an inner peripheral surface facing the through hole in the pad portion is divided only by the conductive layer. |
| 地址 |
Osaka JP |
