发明名称 |
BACK END OF LINE (BEOL) LOCAL OPTIMIZATION TO IMPROVE PRODUCT PERFORMANCE |
摘要 |
The disclosure relates to a locally optimized integrated circuit (IC) including a first portion employing one or more metal interconnects having a first metal width and/or one or more vias having a first via width, and a second portion employing one or more metal interconnects having a second metal width and/or one or more vias having a second via width, wherein the second portion comprises a critical area of the IC, and wherein the second metal width is greater than the first metal width and the second via width is greater than the first via width. A method of locally optimizing an IC includes forming the one or more metal interconnects and/or the one or more vias in the first portion of the IC, and forming the one or more metal interconnects and/or the one or the more vias in the second portion of the integrated circuit. |
申请公布号 |
WO2015160471(A1) |
申请公布日期 |
2015.10.22 |
申请号 |
WO2015US21664 |
申请日期 |
2015.03.20 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
ZHU, JOHN JIANHONG;CHIDAMBARAM, PR;NALLAPATI, GIRIDHAR;YEAP, CHOH FEI |
分类号 |
H01L23/528 |
主分类号 |
H01L23/528 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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