| 发明名称 |
SUBSTRATE TREATMENT APPARATUS, AND METHOD FOR CONTROLLING TEMPERATURE OF HEATER |
| 摘要 |
According to an embodiment of the present invention, a substrate processing apparatus includes: a main chamber having a process space in which a process with respect to a substrate is performed; a heater disposed in the process space to heat the substrate placed on an upper portion thereof; and a cooling ring disposed around the heater, the cooling ring having a plurality of gas passages spaced apart at a predetermined distance around the heater to allow a refrigerant supplied from the outside to selectively flow therein. |
| 申请公布号 |
US2015299860(A1) |
申请公布日期 |
2015.10.22 |
| 申请号 |
US201314646079 |
申请日期 |
2013.12.18 |
| 申请人 |
EUGENE TECHNOLOGY CO., LTD. |
发明人 |
JE Sung-Tae;YANG II-Kwang;LEE Jae-Ho;KIM Kyong-Hun;KIM Myung-In;SHIN Yang-Sik |
| 分类号 |
C23C16/46;C23C16/44 |
主分类号 |
C23C16/46 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate processing apparatus comprising:
a main chamber having a process space in which a process with respect to a substrate is performed; a heater disposed in the process space to heat the substrate placed on an upper portion thereof; and a cooling ring disposed around the heater, the cooling ring having a plurality of gas passages spaced apart at a predetermined distance around the heater to allow a refrigerant supplied from the outside to flow therein. |
| 地址 |
Cheoin-gu, Yongin-si Gyeonggi-do KR |
