发明名称 COMPOUND, AND PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a new compound which can improve the reliability of material used in the production process of an electronic apparatus.SOLUTION: A compound is shown by the formula (1), where n is 0, 1 or 2, X is a single bond or a 1-6C bivalent organic group, and Y is hydrogen or a 1-12C alkyl group.
申请公布号 JP2015182957(A) 申请公布日期 2015.10.22
申请号 JP20140058125 申请日期 2014.03.20
申请人 SUMITOMO BAKELITE CO LTD 发明人 ONISHI OSAMU;IKEDA TAKAO
分类号 C07D305/06;C08F32/04;G03F7/023 主分类号 C07D305/06
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