| 发明名称 |
Device Including Multiple Semiconductor Chips and Multiple Carriers |
| 摘要 |
A device includes a first semiconductor chip that is arranged over a first carrier and includes a first electrical contact. The device further includes a second semiconductor chip arranged over a second carrier and including a second electrical contact arranged over a surface of the second semiconductor chip facing the second carrier. The second carrier is electrically coupled to the first electrical contact and the second electrical contact. |
| 申请公布号 |
US2015303128(A1) |
申请公布日期 |
2015.10.22 |
| 申请号 |
US201414254139 |
申请日期 |
2014.04.16 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Otremba Ralf;Schiess Klaus;Haeberlen Oliver;Kutschak Matteo-Alessandro |
| 分类号 |
H01L23/373;H01L23/522;H01L23/31;H01L25/10;H01L23/495 |
主分类号 |
H01L23/373 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A device, comprising:
a first semiconductor chip arranged over a first carrier and comprising a first electrical contact; and a second semiconductor chip arranged over a second carrier and comprising a second electrical contact arranged over a surface of the second semiconductor chip, the second electrical contact facing the second carrier, wherein the second carrier is electrically coupled to the first electrical contact and the second electrical contact. |
| 地址 |
Neubiberg DE |
