| 摘要 |
Disclosed is a low-flying height in-plane magnetic image recognition sensor chip. The sensor chip comprises a Si substrate (1) whose surface (4) is provided with a pit (2), a magneto-resistive sensor (5), and an insulating layer (6). The magneto-resistive sensor (5) is located on a bottom surface (3) of the pit (2) in the Si substrate (1). The insulating layer (6) is located above the magneto-resistive sensor (5). In a working state, a detection surface of a magnetic image is co-planar or parallel with the surface (3) of the Si substrate (1). An input/output end of the magneto-resistive sensor (5) is in bonding connection with a lead directly, or in bonding connection with a lead by using a pad (7(2)) or by using a conductive pillar (8) and the pad (7(2)), and the flying height of the lead is lower than the height of the surface (4) of the Si substrate (1). This technical solution has the advantages that the structure is compact, packaging is not needed, the chip can directly contact the magnetic image, and output signals are strong. |
