发明名称 MEMS DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To improve mechanical strength of a lid portion or the like covering a cavity in a MEMS device provided with a function element in the cavity.SOLUTION: A MEMS device comprises: a substrate; a function element provided directly or via an insulation film on a surface of the substrate; a structure being provided on the surface of the substrate or a surface of the insulation film and forming a cavity around the function element; a first layer having an opening formed at a predetermined position and covering a part of the cavity with a gap between the first layer and the function element; a second layer being provided on a surface of the first layer and having an opening formed at a position corresponding to the predetermined position; and a sealing section being provided in a range greater than the opening of the first layer and the opening of the second layer on a surface of the second layer, and at least seals the opening of the second layer.
申请公布号 JP2015182188(A) 申请公布日期 2015.10.22
申请号 JP20140061567 申请日期 2014.03.25
申请人 SEIKO EPSON CORP 发明人 YOSHIZAWA TAKAHIKO
分类号 B81B7/02;B81C1/00;H01L23/02;H03H3/02;H03H9/24 主分类号 B81B7/02
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