| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a laminated semiconductor device capable of preventing performance degradation due to a power drop by devising arrangement of power supply wiring or by any other means.SOLUTION: The laminated semiconductor device includes a main chip 10 and a sub chip 20 placed on the main chip 10. The sub chip 20 includes a power circuit which has an impedance lower than that of a first circuit mounted on the main chip and which has a power supply IO30 and a wiring intersection section 41 by a power supply wiring 40, and further a TSV for electrically connecting the first circuit with the wiring intersection section 41.</p> |
