| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board, capable of improving reliability by preventing a solder bump from being damaged.SOLUTION: A wiring board 10 of the present invention is manufactured through an inspection process. In the inspection process, the tip surface 57 of a probe pin 55 is brought into contact with a plurality of solder bumps 21 disposed on a substrate main surface 12 of a substrate body 11 to inspect the conduction of the wiring board 10. In the probe pin 55, the outer diameter A3 of the tip surface 57 is set to be larger than the maximum diameter A1 of the solder bumps 21, and the tip surface 57 has a flat surface or a concave surface.</p> |
