| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a mask that can maximize the number of effective chips per one wafer without increasing the cost for the mask.SOLUTION: A photomask 100 includes a first mask pattern 100 and a second mask pattern 120, in which the first mask pattern 110 and the second mask pattern 120 are disposed to overlap chip segments arranged in 4×4 rows and columns, where chip segments are shifted by one row and one column. In the second mask pattern 120, a parts pattern 150 such as an alignment mark is disposed in a chip segment 130 other than segments in the overlapped area 160 with the first mask pattern 110, and thereby, different mask patterns can be separately subjected to exposure, and the number of effective chips can be maximized.</p> |
