| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a mounting component inspection apparatus with which even an inexperienced worker, when test results having mounting failures are continuously found at a certain component mounting position, can quickly understand the cause and take a measure, and to provide a method thereof. <P>SOLUTION: When an operator selects a plot mark P displayed on a component mounting position map 79, a mounting defect detailed image 83 is displayed on a touch panel 64. At the time of the display, it is determined for each component mounting position whether or not a determination ratio of the mounting defect exceeds a predetermined threshold. When it is determined that the determination ratio exceeds the predetermined threshold, a message indicating "Estimated defect cause: Detection failure in a substrate warpage deformation state. Check the setting state at a measurement point." is displayed. Thereby, even an inexperienced operator can easily and quickly understand that the cause of the mounting defect is due to a detection failure in a substrate warpage deformation state, and can quickly take a measure such as adding a new measurement point at the component mounting position or its neighborhood where the defect has been indicated. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
