| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition improved in electric reliability at high voltage, and an adhesive tape for semiconductor packaging using the same.SOLUTION: The adhesive composition of the present invention contains an epoxy hardener optimal for heightening fracture toughness of a hardened network by heightening a crosslink density in an epoxy resin base material, so that electric reliability is secured at a high voltage of not less than 30 V, and entanglement between molecules in the hardened network is strong to satisfy excellent adhesive strength at a high temperature of not less than 200°C. Thus, the adhesive composition, according to the present invention, is useful for an adhesive tape useful for a semiconductor-packaging field accompanying a high temperature process of not less than 200°C such as wire bonding and soldering, and can be usefully applied to a field such as elevator industry and semiconductor packaging for automobiles where high voltage is impressed. |
