| 摘要 |
<p>The present invention relates to a pressure-sensitive adhesive tape for protecting an electrode plate, containing: a substrate, and a pressure-sensitive adhesive layer provided on at least one side of a the substrate, in which the pressure-sensitive adhesive tape has a piercing resistance, obtained by the following calculation method, of 300 gfmm or more; and has a heat shrinkage ratio, when heating is performed at 260°C for 1 hour, of 1.0% or less in both of TD (width) direction and MD (length) direction, and in which the calculation method contains fixing the pressure-sensitive adhesive tape to a fixing plate in which a circular hole having a diameter of 11.28 mm is formed, piercing a needle of which the end of has a curvature radius of 0.5 mm to the pressure-sensitive adhesive tape at a speed of 2 mm/s under condition of 23 ± 2°C, and measuring a maximum load (gf) and a maximum elongation (mm) of the pressure-sensitive adhesive tape when the needle penetrates the pressure-sensitive adhesive tape; and the piercing resistance is calculated by the following equation (1): Piercing resistance = [Maximum load (gf)] × [Maximum elongation (mm) of the pressure-sensitive adhesive tape] × 1/2 ... (1).</p> |
