SYSTEM AND METHODS OF REMOVING A MULTI-LAYER COATING FROM A SUBSTRATE

摘要

A system for use in removing a multi-layer coating (116) from a substrate (118) is provided. The multi-layer coating includes a first coating (124) applied to the substrate and a second coating (126) applied over the first coating. The first coating (124) is formed from a first material and the second coating (126) is formed from a second material different from the first material. The system includes a grinding mechanism (102) configured to remove the multi-layer coating from the substrate (118), and a controller (104) coupled in communication with the grinding mechanism (102). The controller is configured to position the grinding mechanism (102) against the multi-layer coating (116), initiate a first removal mode (110) that directs the grinding mechanism (102) to traverse across the substrate, monitor a variable operating parameter of the grinding mechanism (102) during the first removal mode (110), and evaluate a value of the variable operating parameter against a predetermined threshold to determine whether the second coating (126) has been removed from the substrate.