| 摘要 |
A process for embossing a structure in an embossing material that is applied on a substrate comprising the steps of embossing the embossing material by an embossing die and hardening the embossing material, wherein at least the substrate and/or the embossing die and/or at least one heating layer arranged between the substrate and the embossing material and/or between the embossing die and the embossing material are irradiated by means of microwaves for hardening the embossing material. |
