| 发明名称 |
Panel assembly having thin bondline with reduced edge stress |
| 摘要 |
A structure may include a first layer, a second layer, and an adhesive layer. The first layer may have a faying surface, a side edge, and a first coefficient of thermal expansion. The second layer may also have a faying surface, a side edge, and a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion. The adhesive layer may be interposed between the first and second faying surfaces. The faying surface of at least one of the first and second layers may include an edge treatment extending along at least a portion of a respective one of the side edges. The edge treatment may have an edge treatment length measured along a direction generally parallel to the faying surface and an edge treatment height measured along a direction generally perpendicular to the faying surface. |
| 申请公布号 |
US9162915(B1) |
申请公布日期 |
2015.10.20 |
| 申请号 |
US201113285632 |
申请日期 |
2011.10.31 |
| 申请人 |
The Boeing Company |
发明人 |
Wilenski Mark S.;Stanley Daniel C.;Kozar Michael P. |
| 分类号 |
B32B1/04;B32B3/02;B32B7/12;B32B9/04;B32B38/10;B32B17/06;C03B21/02;C03C3/06;B26D3/06;C03C19/00;B32B17/00;B32B38/00;B26D3/02;C03C23/00;C03C27/00 |
主分类号 |
B32B1/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A structure, comprising
a first layer having a faying surface, a side edge, and a first coefficient of thermal expansion; a second layer having a faying surface, a side edge, and a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion; an adhesive layer between the faying surface of the first layer and the faying surface of the second layer, the adhesive layer defining a bondline having a main portion and an edge treatment portion; the faying surface of at least one of the first and second layers including an edge treatment extending along at least a portion of a respective one of the side edges, the edge treatment of the at least one of the first and second layers includes a spacer extending toward an opposing one of the first and second layers and supporting the side edge of the at least one of the first and second layers against deflection; and the edge treatment portion of the bondline corresponding to the edge treatment of the at least one of the first and second layers and being located outside of the main portion and tapering in height from the side edge of the at least one of the first and second layers to the main portion of the bondline. |
| 地址 |
Chicago IL US |
