| 发明名称 |
Semiconductor device with die attached heat spreader |
| 摘要 |
A packaged semiconductor device has an integrated circuit (IC) die and a heat spreader. The heat spreader has a first portion with holes formed entirely therethrough. The first portion is attached to the die using thermally-conductive adhesive that fills the holes. The holes enable the heat spreader to be attached to the die without placing excess pressure on the IC die that could cause the die to crack. |
| 申请公布号 |
US9165855(B1) |
申请公布日期 |
2015.10.20 |
| 申请号 |
US201414321826 |
申请日期 |
2014.07.02 |
| 申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
Yow Kai Yun;Eu Poh Leng |
| 分类号 |
H01L23/28;H01L23/367;H01L23/495;H01L23/31;H01L23/00;H01L21/56 |
主分类号 |
H01L23/28 |
| 代理机构 |
|
代理人 |
Berrgere Charles E. |
| 主权项 |
1. A packaged semiconductor device, comprising:
an integrated circuit (IC) die; a heat spreader comprising a first portion having a plurality of holes formed entirely therethrough, and an outer portion, wherein the first portion is a recessed inner portion formed within the outer portion, wherein a vertical distance between a bottom surface of the first portion and a plane of the IC die is less than a vertical distance between the outer portion and the plane of the IC die; and thermally-conductive adhesive that fills the holes to attach the heat spreader to the IC die. |
| 地址 |
Austin TX US |
