| 发明名称 | Wireless interconnects in an interposer | ||
| 摘要 | Some implementations provide an interposer that includes a substrate, a first passive device in the substrate, and a second passive device. The first passive device includes a first set of through substrate vias (TSVs) in the substrate. The second passive device is configured to wirelessly couple to the first passive device. In some implementations, the second passive device includes a second set of through substrate vias (TSVs) in the substrate. In some implementations, the second passive device is configured to inductively couple to the first passive device. In some implementations, the first passive device is a first inductor and the second passive device is a second inductor. In some implementations, the interposer further includes a first set of interconnects coupled to the first set of TSVs, and a second set of interconnects coupled to the second set of TSVs. | ||
| 申请公布号 | US9165791(B2) | 申请公布日期 | 2015.10.20 |
| 申请号 | US201314069201 | 申请日期 | 2013.10.31 |
| 申请人 | QUALCOMM Incorporated | 发明人 | Wu Xiaoxia;Yang Yunqiang;Zuo Chengjie;Lisk Durodami Joscelyn |
| 分类号 | H01L23/522;H01L21/48;H01L49/02;H01L23/538;H01L23/498 | 主分类号 | H01L23/522 |
| 代理机构 | Loza & Loza, LLP | 代理人 | Loza & Loza, LLP |
| 主权项 | 1. An interposer comprising: a substrate; a first passive device in the substrate, the first passive device comprising a first set of through substrate vias (TSVs) in the substrate; and a second passive device configured to inductively couple to the first passive device, the second passive device comprising a second set of TSVs in the substrate, the first set of TSVs and the second set of TSVs positioned laterally to each other in the same layer of the substrate. | ||
| 地址 | San Diego CA US | ||