| 发明名称 |
Systems and methods for managing heat generated by electronic equipment in an electronic equipment enclosure |
| 摘要 |
A system for managing heat generated by electronic equipment in an electronic equipment enclosure is provided. The system includes a duct adapted to receive a first portion of the electronic equipment. The first portion of the electronic equipment includes an air intake opening. The duct forms a barrier between the first portion of the electronic equipment and a second portion of the electronic equipment. The second portion of the electronic equipment includes an air exhaust opening. The barrier separates cooled air entering the air intake opening and heated air exiting the air exhaust opening. |
| 申请公布号 |
US9167719(B2) |
申请公布日期 |
2015.10.20 |
| 申请号 |
US201314017924 |
申请日期 |
2013.09.04 |
| 申请人 |
Panduit Corp. |
发明人 |
Arflack Brian K.;Adducci Samuel J. |
| 分类号 |
H05K7/20;H05K7/14 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
Clancy Christopher S.;Williams James H. |
| 主权项 |
1. A system for managing heat generated by electronic equipment in an electronic equipment enclosure, the system comprising a duct adapted to receive a first portion of the electronic equipment, the first portion of the electronic equipment comprising an air intake opening, wherein the duct forms a barrier between the first portion of the electronic equipment and a second portion of the electronic equipment, the second portion of the electronic equipment comprising an air exhaust opening, wherein the barrier separates cooled air entering the air intake opening and heated air exiting the air exhaust opening. |
| 地址 |
Tinley Park IL US |
