发明名称 Closed loop temperature controlled circuit to improve device stability
摘要 An integrated circuit is provided having an active circuit. A heating element is adjacent to the active circuit and configured to heat the active circuit. A temperature sensor is also adjacent to the active circuit and configured to measure a temperature of the active circuit. A temperature controller is coupled to the active circuit and configured to receive a temperature signal from the temperature sensor. The temperature controller operates the heating element to heat the active circuit to maintain the temperature of the active circuit in a selected temperature range.
申请公布号 US9165853(B2) 申请公布日期 2015.10.20
申请号 US201414586231 申请日期 2014.12.30
申请人 STMicroelectronics Asia Pacific Pte. Ltd.;STMicroelectronics, Inc. 发明人 Wang Fuchao;Leneel Olivier;Shankar Ravi
分类号 H05B1/02;H01L23/34;H05B3/12;H05B3/34;H05B3/02 主分类号 H05B1/02
代理机构 Seed IP Law Group PLLC 代理人 Seed IP Law Group PLLC
主权项 1. A device comprising: a first semiconductor die; an active circuit in the first semiconductor die; a temperature sensor configured to measure a temperature of the active circuit; a second semiconductor die coupled to the first semiconductor die; a heating element on the second semiconductor die, the heating element configured to heat the active circuit of the first semiconductor die; and a temperature controller configured to receive temperature data from the temperature sensor and data regarding a level of use of the active circuit from the active circuit, to operate the heating element according to the temperature data and the level of use of the active circuit, and to cause the heating element to heat the active circuit to maintain the temperature of the active circuit above a minimum threshold temperature and below a maximum threshold temperature.
地址 Singapore SG
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