Balun with integrated decoupling as ground shield

摘要

An apparatus is provided. Transmission line cells are formed in a first region. A first metallization layer is formed over the transmission line cells within a portion of the first region. At least a portion of the first metallization layer is electrically coupled to the plurality of transmission line cells. A second metallization layer is formed over the first metallization layer with an interconnect portion, and overlay portion, and a first balun. The interconnect portion at least partially extends into the first region, and the overlay portion is within the first region. The first balun winding is electrically coupled to the overlay portion and partially extends into a second region. The first region partially surrounds the second region. A third metallization layer is formed over the second metallization layer having a second balun winding within the second region, where the second winding is generally coaxial with the first balun winding.

主权项

1. An apparatus comprising:
a plurality of transmission line cells formed in a first region; a first metallization layer formed over the plurality of transmission line cells within a portion of the first region, wherein at least a portion of the first metallization layer is electrically coupled to the plurality of transmission line cells; a second metallization layer formed over the first metallization layer, wherein the second metallization layer includes:
an interconnect portion that at least partially extends into the first region;an overlay portion within the first region;a first balun winding that is electrically coupled to the overlay portion and that partially extends into a second region, wherein the first region partially surrounds the second region; and a third metallization layer formed over the second metallization layer having a second balun winding within the second region, wherein the second balun winding is generally coaxial with the first balun winding.